Different polytypes exhibit different properties, in which the cubic phase of SiC (3C-SiC) shows increased values for the thermal conductivity and breakdown field compared to other polytypes\cite{wesch96}, which is, thus, most effective for high-performance electronic devices.
Much progress has been made in 3C-SiC thin film growth by chemical vapor deposition (CVD) and molecular beam epitaxy (MBE) on hexagonal SiC\cite{powell90,fissel95,fissel95_apl} and Si\cite{nishino83,nishino87,kitabatake93,fissel95_apl} substrates.
However, the frequent occurrence of defects such as twins, dislocations and double position boundaries remains a challenging problem.
Different polytypes exhibit different properties, in which the cubic phase of SiC (3C-SiC) shows increased values for the thermal conductivity and breakdown field compared to other polytypes\cite{wesch96}, which is, thus, most effective for high-performance electronic devices.
Much progress has been made in 3C-SiC thin film growth by chemical vapor deposition (CVD) and molecular beam epitaxy (MBE) on hexagonal SiC\cite{powell90,fissel95,fissel95_apl} and Si\cite{nishino83,nishino87,kitabatake93,fissel95_apl} substrates.
However, the frequent occurrence of defects such as twins, dislocations and double position boundaries remains a challenging problem.