+% postannealing less efficient than hot implantation
+Experimental studies revealed increased implantation temperatures to be more efficient than postannealing methods for the formation of topotactically aligned precipitates\cite{eichhorn02}.
+In particular restructuring of strong C-C bonds is affected\cite{deguchi92}, which preferentially arise if additional kinetic energy provided by an increase of the implantation temperature is missing to accelerate or even enable atomic rearrangements.
+We assume this to be related to the problem of slow structural evolution encountered in the high C concentration simulations due to the insertion of high amounts of C into a small volume within a short period of time resulting in essentially no time for the system to rearrange.
+% rt implantation + annealing
+Implantations of an understoichiometric dose at room temperature followed by thermal annealing results in small spherical sized C$_{\text{i}}$ agglomerates at temperatures below \unit[700]{$^{\circ}$C} and SiC precipitates of the same size at temperatures above \unit[700]{$^{\circ}$C}\cite{werner96}.
+Since, however, the implantation temperature is considered more efficient than the postannealing temperature, SiC precipitates are expected -- and indeed are observed for as-implanted samples\cite{lindner99,lindner01} -- in implantations performed at \unit[450]{$^{\circ}$C}.
+Implanted C is therefor expected to occupy substitutionally usual Si lattice sites right from the start.
+
+Thus, we propose an increased participation of C$_{\text{s}}$ already in the initial stages of the implantation process at temperatures above \unit[450]{$^{\circ}$C}, the temperature most aplicable for the formation of SiC layers of high crystalline quality and topotactical alignment\cite{lindner99}.