+In the following the 3C-SiC/c-Si interface is described in further detail.
+One important size analyzing the interface is the interfacial energy.
+It is determined exactly in the same way than the formation energy as described in equation \eqref{eq:defects:ef2}.
+Using the notation of table \ref{table:md:sic_prec} and assuming that the system is composed out of $N^{\text{3C-SiC}}_{\text{C}}$ C atoms forming the SiC compound plus the remaining Si atoms, the energy is given by
+\begin{equation}
+ E_{\text{f}}=E-
+ N^{\text{3C-SiC}}_{\text{C}} \mu_{\text{SiC}}-
+ \left(N^{\text{total}}_{\text{Si}}-N^{\text{3C-SiC}}_{\text{C}}\right)
+ \mu_{\text{Si}} \text{ ,}
+\label{eq:md:ife}
+\end{equation}
+with $E$ being the free energy of the precipitate configuration at zero temperature.
+An interfacial energy of 2267.28 eV is obtained.
+The amount of C atoms together with the observed lattice constant of the precipitate leads to a precipitate radius of 29.93 \AA.
+Thus, the interface tension, given by the energy of the interface devided by the surface area of the precipitate is $20.15\,\frac{\text{eV}}{\text{nm}^2}$ or $3.23\times 10^{-4}\,\frac{\text{J}}{\text{cm}^2}$.
+This is located inside the eperimentally estimated range of $2-8\times 10^{-4}\,\frac{\text{J}}{\text{cm}^2}$ \cite{taylor93}.
+
+Since the precipitate configuration is artificially constructed the resulting interface does not necessarily correspond to the energetically most favorable configuration or to the configuration that is expected for an actually grown precipitate.
+Thus annealing steps are appended to the gained structure in order to allow for a rearrangement of the atoms of the interface.
+The precipitate structure is rapidly heated up to $2050\,^{\circ}\mathrm{C}$ with a heating rate of approximately $75\,^{\circ}\mathrm{C}/\text{ps}$.
+From that point on the heating rate is reduced to $1\,^{\circ}\mathrm{C}/\text{ps}$ and heating is continued to 120 \% of the Si melting temperature, that is 2940 K.
+\begin{figure}[!ht]
+\begin{center}
+\includegraphics[width=12cm]{fe_and_t_sic.ps}
+\end{center}
+\caption{Free energy and temperature evolution of a constructed 3C-SiC precipitate embedded in c-Si at temperatures above the Si melting point.}
+\label{fig:md:fe_and_t_sic}
+\end{figure}
+Figure \ref{fig:md:fe_and_t_sic} shows the free energy and temperature evolution.
+The sudden increase of the free energy indicates possible melting occuring around 2840 K.
+\begin{figure}[!ht]
+\begin{center}
+\includegraphics[width=12cm]{pc_500-fin.ps}
+\end{center}
+\caption{Radial distribution of the constructed 3C-SiC precipitate embedded in c-Si at temperatures below and above the Si melting transition point.}
+\label{fig:md:pc_500-fin}
+\end{figure}
+Investigating the radial distribution function shown in figure \ref{fig:md:pc_500-fin}, which shows configurations below and above the temperature of the estimated transition, indeed supports the assumption of melting gained by the free energy plot.
+However the precipitate itself is not involved, as can be seen from the Si-C and C-C distribution, which essentially stays the same for both temperatures.
+Thus, it is only the c-Si surrounding undergoing a structural phase transition, which is very well reflected by the difference observed for the two Si-Si distributions.
+This is surprising since the melting transition of plain c-Si is expected at temperatures around 3125 K, as discussed in the last section.
+Obviously the precipitate lowers the transition point of the surrounding c-Si matrix.
+For the rearrangement simulations temperatures well below the transition point should be used since it is very unlikely to recrystallize the molten Si surrounding properly when cooling down.
+To play safe the precipitate configuration at 100 \% of the Si melting temperature is chosen and cooled down to $20\,^{\circ}\mathrm{C}$ with a cooling rate of $1\,^{\circ}\mathrm{C}/\text{ps}$.
+{\color{blue}TODO: Wait for results and then compare structure (PC) and interface energy, maybe a energetically more favorable configuration arises.}
+{\color{red}TODO: Mention the fact, that the precipitate is stable for eleveated temperatures, even for temperatures where the Si matrix is melting.}
+{\color{red}TODO: Si starts to melt at the interface, show pictures and explain, it is due to the defective interface region.}
+
+\subsection{Simulations at temperatures around the silicon melting point}
+
+As discussed in section \ref{subsection:md:limit} and \ref{subsection:md:inct} a further increase of the system temperature might help to overcome limitations of the short range potential and accelerate the dynamics involved in structural evolution.
+A maximum temperature to avoid melting was determined in section \ref{subsection:md:tval}, which is 120 \% of the Si melting point.
+In the following simulations the system volume, the amount of C atoms inserted and the shape of the insertion volume are modified from the values used in the first MD simulations to now match the conditions given in the simulations of the self-constructed precipitate configuration for reasons of comparability.
+To quantify, the initial simulation volume now consists of 21 Si unit cells in each direction and 5500 C atoms are inserted in either the whole volume or in a sphere with a radius of 3 nm.
+Since the investigated temperatures exceed the Si melting point the initial Si bulk material is heated up slowly by $1\,^{\circ}\mathrm{C}/\text{ps}$ starting from $1650\,^{\circ}\mathrm{C}$ before the C insertion sequence is started.
+The 100 ps sequence at the respective temperature intended for the structural evolution is exchanged by a 10 ns sequence, which will hopefully result in the occurence of infrequent processes.
+The return to lower temperatures is considered seperately.