High-dose carbon implantation into \ac{c-Si} with subsequent or in situ annealing was found to result in SiC microcrystallites in Si \cite{borders71}.
\ac{RBS} and \ac{IR} spectroscopy investigations indicate a \unit[10]{at.\%} C concentration peak and the occurence of disordered C-Si bonds after implantation at \ac{RT} followed by crystallization into SiC precipitates upon annealing demonstrated by a shift in the \ac{IR} absorption band and the disappearance of the C profile peak in \ac{RBS}.
-Implantations at different temperatures revealed a strong influences of the implantation temperature on the compound structure \cite{edelman76}.
-Temperatures below \unit[500]{$^{\circ}$C} result in amorphous layers, which is transformed into polycrystalline 3C-SiC after \unit[850]{$^{\circ}$C} annealing \cite{edelman76}.
+Implantations at different temperatures revealed a strong influence of the implantation temperature on the compound structure \cite{edelman76}.
+Temperatures below \unit[500]{$^{\circ}$C} result in amorphous layers, which is transformed into polycrystalline 3C-SiC after \unit[850]{$^{\circ}$C} annealing.
Otherwise single crystalline 3C-SiC is observed for temperatures above \unit[600]{$^{\circ}$C}.
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-Utilized and enhanced, 30 years devel ... (-32)
-By understanding some basci processes (32-36), \ac{IBS} nowadays has become a promising method to form thin SiC layers of high quality exclusively of the 3C polytype embedded in and epitactically aligned to the Si host featuring a sharp interface \cite{lindner99,lindner01,lindner02}.
+Annealing temperatures necessary for the onset of the amorphous to crystalline transition have been confirmed by further studies \cite{kimura81,kimura82}.
+Overstoichiometric doses result in the formation of clusters of C, which do not contribute to SiC formation during annealing up to \unit[1200]{$^{\circ}$C} \cite{kimura82}.
+The amount of formed SiC, however, increases with increasing implantation temperature.
+The authors, thus, concluded that implantations at elevated temperatures lead to a reduction in the annealing temperatures required for the synthesis of homogeneous layers of SiC.
+In a comparative study of O, N and C implantation into Si, the absence of the formation of a stoichiometric SiC compound layer involving the transition of a Gaussian into a box-like C profile with respect to the implantation depth for the superstoichiometric C implantation and an annealing temeprature of \unit[1200]{$^{\circ}$C} in contrast to the O and N implantations, which successfully form homogeneous layers, has been observed \cite{reeson86}.
+This was attrubuted to the difference in the enthalpy of formation of the respective compound and the different mobility of the respective impurity in bulk Si.
+Thus, higher annealing temperatures and longer annealing times were considered necessary for the formation of homogeneous SiC layers.
+Indeed, for the first time, buried homogeneous and stoichiometric epitaxial 3C-SiC layers embedded in single crystalline Si were obtained by the same group consequently applying annealing temperatures of \unit[1405]{$^{\circ}$C} for \unit[90]{min} and implantation temperatures of approximately \unit[550]{$^{\circ}$C} \cite{reeson87}.
+The necessity of the applied extreme temperature and time scale is attributed to the stability of substitutional C within the Si matrix being responsible for high activation energies necessary to dissolve such precipitates and, thus, allow for redistribution of the implanted C atoms.
+In order to avoid extreme annealing temperatures close to the melting temperature of Si, triple-energy implantations in the range from \unit[180-190]{keV} with stoichiometric doses at a constant target temperature of \unit[860]{$^{\circ}$C} achieved by external substrate heating were performed \cite{martin90}.
+It was shown that a thick buried layer of SiC is directly formed during implantation, which consists of small, only slightly misorientated but severely twinned 3C-SiC crystallites.
+The authors assumed that due to the auxiliary heating rather than ion beam heating as employed in all the preceding studies, the complexity of the remaining defects in the synthsized structure is fairly reduced.
+Since no amorphous or polycrystalline regions have been identified, twinning is considered to constitute the main limiting factor in the \ac{IBS} of SiC.
+... maybe nejim?!?
+... lindner limit in dose -> 1250
+... two temp implantation ... sharp interface
+By understanding some basic processes (32-36), \ac{IBS} nowadays has become a promising method to form thin SiC layers of high quality exclusively of the 3C polytype embedded in and epitactically aligned to the Si host featuring a sharp interface \cite{lindner99,lindner01,lindner02}.
\section{Substoichiometric concentrations of carbon in crystalline silicon}
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