\usepackage{graphicx}
\graphicspath{{../img/}}
+\usepackage{miller}
+
\usepackage[setpagesize=false]{hyperref}
\usepackage{semcolor}
}
\begin{itemize}
- \item Fabrication of silicon carbide and different polytypes
- \item Precipitation model of 3C-SiC in Si
+ \item Polyteps and fabrication of silicon carbide
+ \item Supposed precipitation mechanism of SiC in Si
\item Utilized simulation techniques
\begin{itemize}
\item Molecular dynamics (MD) simulations
\small
-\begin{tabular}{l | c c c c c c}
+\begin{tabular}{l c c c c c c}
\hline
& 3C-SiC & 4H-SiC & 6H-SiC & Si & GaN & Diamond\\
\hline
-Hardness [Mohs] & 9.6 & & & 6.5 & & 10 \\
+Hardness [Mohs] & \multicolumn{3}{c}{------ 9.6 ------}& 6.5 & - & 10 \\
Band gap [eV] & 2.36 & 3.23 & 3.03 & 1.12 & 3.39 & 5.5 \\
-Break down field [$10^6$ V/cm] & & & & & & \\
-Saturation drift velocity [] & & & & & & \\
-Electron mobility [] & & & & & & \\
-Hole mobility [] & & & & & & \\
-Thermal conductivity [] & & & & & & \\
+Break down field [$10^6$ V/cm] & 4 & 3 & 3.2 & 0.6 & 5 & 10 \\
+Saturation drift velocity [$10^7$ cm/s] & 2.5 & 2.0 & 2.0 & 1 & 2.7 & 2.7 \\
+Electron mobility [cm$^2$/Vs] & 800 & 900 & 400 & 1100 & 900 & 2200 \\
+Hole mobility [cm$^2$/Vs] & 320 & 120 & 90 & 420 & 150 & 1600 \\
+Thermal conductivity [W/cmK] & 5.0 & 4.9 & 4.9 & 1.5 & 1.3 & 22 \\
\hline
\end{tabular}
+{\tiny
+ Values for $T=300$ K
+}
+
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\includegraphics[width=7cm]{polytypes.eps}
\end{picture}
+\begin{picture}(0,0)(-10,-185)
+ \includegraphics[width=3.8cm]{cubic_hex.eps}\\
+\end{picture}
+\begin{picture}(0,0)(-10,-175)
+ {\tiny cubic (twist)}
+\end{picture}
+\begin{picture}(0,0)(-60,-175)
+ {\tiny hexagonal (no twist)}
+\end{picture}
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\end{slide}
\end{slide}
+\begin{slide}
+
+ {\large\bf
+ Fabrication of silicon carbide
+ }
+
+ \small
+
+ Alternative approach:
+ Ion beam synthesis (IBS) of burried 3C-SiC layers in Si\hkl(1 0 0)
+ \begin{itemize}
+ \item \underline{Implantation step 1}\\
+ 180 keV C$^+$, $D=7.9\times 10^{17}$ cm$^{-2}$, $T_{\text{i}}=500\,^{\circ}\mathrm{C}$\\
+ $\Rightarrow$ box-like distribution of equally sized
+ and epitactically oriented SiC precipitates
+
+ \item \underline{Implantation step 2}\\
+ 180 keV C$^+$, $D=0.6\times 10^{17}$ cm$^{-2}$, $T_{\text{i}}=250\,^{\circ}\mathrm{C}$\\
+ $\Rightarrow$ destruction of SiC nanocrystals
+ in growing amorphous interface layers
+ \item \underline{Annealing}\\
+ $T=1250\,^{\circ}\mathrm{C}$, $t=10\,\text{h}$\\
+ $\Rightarrow$ homogeneous, stoichiometric SiC layer
+ with sharp interfaces
+ \end{itemize}
+
+ \begin{minipage}{6.3cm}
+ \includegraphics[width=6cm]{ibs_3c-sic.eps}\\[-0.2cm]
+ {\tiny
+ XTEM micrograph of single crystalline 3C-SiC in Si\hkl(1 0 0)
+ }
+ \end{minipage}
+ \begin{minipage}{6.3cm}
+ \begin{center}
+ {\color{blue}\bf\normalsize
+ Precipitation mechanism not yet fully understood!
+ }
+ \renewcommand\labelitemi{$\Rightarrow$}
+ \small
+ \underline{Understanding the SiC precipitation}
+ \begin{itemize}
+ \item significant technological progress in SiC thin film formation
+ \item perspectives for processes relying upon prevention of SiC precipitation
+ \end{itemize}
+ \end{center}
+ \end{minipage}
+
+\end{slide}
+
+\begin{slide}
+
+ {\large\bf
+ Supposed precipitation mechanism of SiC in Si
+ }
+
+ \scriptsize
+
+ \vspace{0.1cm}
+
+ \begin{minipage}{3.8cm}
+ Si \& SiC lattice structure\\[0.2cm]
+ \includegraphics[width=3.5cm]{sic_unit_cell.eps}\\[-0.3cm]
+ \hrule
+ \end{minipage}
+ \hspace{0.6cm}
+ \begin{minipage}{3.8cm}
+ \begin{center}
+ \includegraphics[width=3.3cm]{tem_c-si-db.eps}
+ \end{center}
+ \end{minipage}
+ \hspace{0.6cm}
+ \begin{minipage}{3.8cm}
+ \begin{center}
+ \includegraphics[width=3.3cm]{tem_3c-sic.eps}
+ \end{center}
+ \end{minipage}
+
+ \begin{minipage}{4cm}
+ \begin{center}
+ C-Si dimers (dumbbells)\\[-0.1cm]
+ on Si interstitial sites
+ \end{center}
+ \end{minipage}
+ \hspace{0.2cm}
+ \begin{minipage}{4.2cm}
+ \begin{center}
+ Agglomeration of C-Si dumbbells\\[-0.1cm]
+ $\Rightarrow$ dark contrasts
+ \end{center}
+ \end{minipage}
+ \hspace{0.2cm}
+ \begin{minipage}{4cm}
+ \begin{center}
+ Precipitation of 3C-SiC in Si\\[-0.1cm]
+ $\Rightarrow$ Moir\'e fringes\\[-0.1cm]
+ \& release of Si self-interstitials
+ \end{center}
+ \end{minipage}
+
+ \begin{minipage}{3.8cm}
+ \begin{center}
+ \includegraphics[width=3.3cm]{sic_prec_seq_01.eps}
+ \end{center}
+ \end{minipage}
+ \hspace{0.6cm}
+ \begin{minipage}{3.8cm}
+ \begin{center}
+ \includegraphics[width=3.3cm]{sic_prec_seq_02.eps}
+ \end{center}
+ \end{minipage}
+ \hspace{0.6cm}
+ \begin{minipage}{3.8cm}
+ \begin{center}
+ \includegraphics[width=3.3cm]{sic_prec_seq_03.eps}
+ \end{center}
+ \end{minipage}
+
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+\end{slide}
+
\end{document}