+\begin{figure}[!ht]
+\begin{center}
+\includegraphics[width=12cm]{12_pc_thesis.ps}\\
+\includegraphics[width=12cm]{12_pc_c_thesis.ps}
+\end{center}
+\caption[Si-C and C-C radial distribution for the high concentration simulations at different elevated temperatures.]{Si-C (top) and C-C (bottom) radial distribution for the high concentration simulations at different elevated temperatures. All structures are cooled down to $20\,^{\circ}\mathrm{C}$.}
+\label{fig:md:12_pc}
+\end{figure}
+Figure \ref{fig:md:12_pc} displays the radial distribution for Si-C and C-C pairs obtained from high C concentration simulations at different elevated temperatures.
+Again, in both cases, the cut-off artifact decreases with increasing temperature.
+Peaks that already exist for the low temperature simulations get slightly more distinct for elevated temperatures.
+This is also true for peaks located past distances of next neighbours indicating an increase for the long range order.
+However this change is rather small and no significant structural change is observeable.
+Due to the continuity of high amounts of damage investigations of atomic configurations below remain hard to identify even for the highest temperature.
+Other than in the low concentration simulations analyzed defect structures are no longer necessarily aligned to the primarily existing but succesively disappearing c-Si host matrix inhibiting or at least hampering their identification and classification.
+As for low temperatures order in the short range exists decreasing with increasing distance.
+The increase of the amount of Si-C pairs at 0.186 nm could pe positively interpreted since this type of bond also exists in 3C-SiC.
+On the other hand the amount of next neighboured C atoms with a distance of approximately 0.15 nm, which is the distance of C in graphite or diamond, is likewise increased.
+Thus, higher temperatures seem to additionally enhance a conflictive process, that is the formation of C agglomerates, instead of the desired process of 3C-SiC formation.
+This is supported by the C-C peak at 0.252 nm, which corresponds to the second next neighbour distance in the diamond structure of elemental C.
+Investigating the atomic data indeed reveals two C atoms which are bound to and interconnect by a third C atom to be responsible for this distance.
+The C-C peak at about 0.31 nm, wich is slightly shifted to higher distances (0.317 nm) with increasing temperature still corresponds quite well to the next neighbour distance of C in 3C-SiC as well as a-SiC and indeed results from C-Si-C bonds.
+The Si-C peak at 0.282 nm, which is pronounced with increasing temperature is constructed out of a Si atom and a C atom, which are both bound to another central C atom.
+This is similar for the Si-C peak at approximately 0.35 nm.
+In this case, the Si and the C atom are bound to a central Si atom.
+
+Regarding these findings there is clear evidence ...
+
+This said, there is clear evidence that this is amorphous SiC
+However there is no significant change in structure.
+But there is a decrease in the artifacts of the potential.
+So, first limitations might be condiered as
+Now, more temperature to increase infrequent events ...