Cleaning of the substrate surface with HCl is required prior to carbonization.
During carbonization the Si surface is chemically converted into a SiC film with a thickness of a few nm by exposing it to a flux of C atoms and concurrent heating up to temperatures about \unit[1400]{$^{\circ}$C}.
In a next step, the epitaxial deposition of SiC is realized by an additional supply of Si atoms at similar temperatures.
+Low defect densities in the buffer layer are a prerequisite for obtaining good quality SiC layers during growth, although defect densities decrease with increasing distance of the SiC/Si interface \cite{}.
+Next to surface morphology defects such as pits and islands, the main defects in 3C-SiC heteroepitaxial layers are twins, stacking faults (SF) and antiphase boundaries (APB) \cite{}.
+off-axis?
+
+lower temps ... to limit thermal stress due to differing expansion coefficients ...
+
\section{Ion beam synthesis of cubic silicon carbide}
\section{Substoichiometric concentrations of carbon in crystalline silicon}
\section{Assumed cubic silicon carbide conversion mechanisms}
\label{section:assumed_prec}
-on surface ... md contraction along 110 ... kitabatake ... and ref in lindner
+on surface ... md contraction along 110 ... kitabatake ... and ref in lindner ... rheed from si to sic ...
in ibs ... lindner and skorupa ...